Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 3 Good Health and Well-being -
SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure
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Dive into the research topics where Jong Hyun Lee is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
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Comparison of particle size distributions between conventional cigarettes and electronic cigarettes based on aerosolization mechanisms, and development of a dosing algorithm for human deposition fraction
Gwak, S., Kim, C., Kwon, H., Lee, J., Cho, Y., Cho, S., Lee, Y. & Kwak, D. B., 2026, (Accepted/In press) In: Journal of Occupational and Environmental Hygiene.Research output: Contribution to journal › Article › peer-review
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Bonding Characteristics in Air of a Decomposable Composite Sheet Containing Sn-3.0Ag-0.5Cu Particles for Formation of a Robust Metallic Solder Joint in Die Attachment
Lee, H. M. & Lee, J. H., May 2025, In: Journal of Manufacturing and Materials Processing. 9, 5, 161.Research output: Contribution to journal › Article › peer-review
Open Access -
Corrosion Behavior Analysis of Novel Sn-2.5Ag-1.0Bi-0.8Cu-0.05Ni and Sn-1.8Bi-0.75Cu-0.065Ni Pb-Free Solder Alloys via Potentiodynamic Polarization Test
Jung, S. H. & Lee, J. H., Jun 2025, In: Metals. 15, 6, 670.Research output: Contribution to journal › Article › peer-review
Open Access1 Scopus citations -
Effects of Ag shell morphology on sinter-bonding by thermo-compression of micron Cu@Ag/submicron Ag composite paste
Kim, Y. & Lee, J. H., May 2025, In: Journal of Materials Science: Materials in Electronics. 36, 14, 810.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
Effects of Fine Cu Particle Size on Sinter-Bondability in Die Bonding Using Cu Paste Possessing Effective Reducing Formulation
Kim, H. & Lee, J. H., Apr 2025, In: Metals. 15, 4, 379.Research output: Contribution to journal › Article › peer-review
Open Access1 Scopus citations