Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 7 Affordable and Clean Energy
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SDG 9 Industry, Innovation, and Infrastructure
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Dive into the research topics where Sarah Eunkyung Kim is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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Reactive Sputtering of SiCN Films: Process Optimization and Bonding Behavior for Cu Hybrid Bonding
Choi, J., Jang, S. & Kim, S. E., Jan 2026, In: Journal of Electronic Materials. 55, 1, p. 1222-1233 12 p.Research output: Contribution to journal › Article › peer-review
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C2H4 reductive plasma treatment on copper surface for copper bonding
Lee, D., Lee, H., Choi, J., Jang, S. & Kim, S. E., 1 May 2025, In: Materials Research Express. 12, 5, 055905.Research output: Contribution to journal › Article › peer-review
Open Access -
Characteristics of PVD SiCN for Application in Hybrid Cu Bonding
Choi, J., Jang, S., Lee, D., Kang, S., Kim, S. & Kim, S. E., Feb 2025, In: Journal of Semiconductor Technology and Science. 25, 1, p. 102-108 7 p.Research output: Contribution to journal › Article › peer-review
2 Scopus citations -
Characterization of Thermal Conductance of Copper-to-Copper Bonded Interconnects with Metal Passivation for Three-Dimensional Integration
Kim, H., Kim, I., Lee, W., Hwang, J. Y., Kim, S. E., Joo, Y. C. & Jang, H., Nov 2025, In: Electronic Materials Letters. 21, 6, p. 829-842 14 p.Research output: Contribution to journal › Article › peer-review
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Effect of Ar/N2 Two-Step Plasma Treatments on the Interfacial Characteristics of Low-Temperature Cu-Cu Direct Bonding
Kim, G., Choi, S., Kwon, Y., Kim, S. E., Lee, H. J. & Park, Y. B., May 2025, In: Electronic Materials Letters. 21, 3, p. 429-442 14 p.Research output: Contribution to journal › Article › peer-review
1 Scopus citations