Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
-
SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure
Fingerprint
Dive into the research topics where Sung Dong Kim is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
- 1 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
-
Focusing and enrichment of deep-submicron particles and exosomes in a viscoelastic fluid using a hybrid cruciform-square microchannel
Jang, J., Cho, Y., Kim, S., Ahn, G., Ahn, J. Y., Kim, J., Lee, S. W., Jeong, O. C., Lee, M. H. & Cho, Y., Feb 2026, In: Microfluidics and Nanofluidics. 30, 2, 20.Research output: Contribution to journal › Article › peer-review
-
Improving the Enrichment of Submicron-Sized Particles by Size Decreasing of Cruciform Cross-Sectional Microchannel in Viscoelastic Microfluidics
Jang, J., Kim, E., Kim, S., Jeong, O. C., Lee, S. & Cho, Y., Jun 2025, In: Biosensors. 15, 6, 370.Research output: Contribution to journal › Article › peer-review
Open Access2 Scopus citations -
Stability Assessment and Current Controller Design for Multiple Grid-Connected Inverters Under LC Grid Impedance and Grid Distortions
Kim, S. D., Kang, M., Yeo, S. Y., Cu, L. D. T. & Kim, K. H., Oct 2025, In: Energies. 18, 20, 5524.Research output: Contribution to journal › Article › peer-review
Open Access -
The Role of Preparation and Bonding Parameters in Improving Hybrid Bonding Quality
Kim, I., Lee, S., Kang, M., Jang, J., Jin, H. & Kim, S., 2025, Proceedings - IEEE 75th Electronic Components and Technology Conference, ECTC 2025. Institute of Electrical and Electronics Engineers Inc., p. 1827-1831 5 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
1 Scopus citations -
Fabrication of Multi-RDL Layers with Polymeric IDL for RDL Interposer
Jang, J., Kang, M., Kim, I., Lee, S., Jin, H. & Kim, S., 2024, Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024. Shin, S., Toh, C. H., Lim, Y. K., Chidambaram, V. & Chui, K. J. (eds.). Institute of Electrical and Electronics Engineers Inc., p. 501-504 4 p. (Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review