Abstract
Thermal management becomes a key technology as the power density of high performance and high density devices increases. Conventional heat sink or TIM methods will be limited to resolve thermal problems of next-generation IC devices. Recently, to increase heat flux through high powered IC devices liquid cooling system has been actively studied. In this study a chip-level liquid cooling system with TSV and microchannel was fabricated on Si wafer using DRIE process and analyzed the cooling characteristics. Three different TSV shapes were fabricated and the effect of TSV shapes was analyzed. The shape of liquid flowing through microchannel was observed by fluorescence microscope. The temperature differential of liquid cooling system was measured by IR microscope from RT to $300^{\circ}C$.
| Translated title of the contribution | Study of Chip-level Liquid Cooling for High-heat-flux Devices |
|---|---|
| Original language | Korean |
| Pages (from-to) | 27-31 |
| Number of pages | 5 |
| Journal | 마이크로전자및패키징학회지 |
| Volume | 22 |
| Issue number | 2 |
| DOIs | |
| State | Published - Jun 2015 |