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구리 질화막을 이용한 구리 접합 구조의 접합강도 연구
Translated title of the contribution
:
Bonding Strength Evaluation of Copper Bonding Using Copper Nitride Layer
Sarah Eunkyung Kim
Dept. of Semiconductor Engineering
Research output
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Contribution to journal
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peer-review
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Dive into the research topics of 'Bonding Strength Evaluation of Copper Bonding Using Copper Nitride Layer'. Together they form a unique fingerprint.
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Engineering
Bonding Strength
100%
Nitride Layer
100%
Bonding Process
75%
Low-Temperature
50%
Plasma Treatment
50%
Test Method
50%
Plasma Process
25%
Systems Performance
25%
Process Condition
25%
Shear Bonding Strength
25%
Core Technology
25%
Material Science
Nitride Compound
100%
Surface (Surface Science)
50%
Shear Strength
50%
Shear Testing
50%