Abstract
Recently much research are has been done into the compositions of lead-free solders. As a result, there has been a rapid increase in the number of new compositions. In the past, the properties of these new compositions were determined and verified through drop-impact tests. However, these drop tests were expensive and it took a long time to obtain a result. The main goal of this study was to establish an analytical method capable of predicting the impact life-time of a new solder composition for board-level flip chips though the application of drop simulations using LS-DYNA. Based on the reaction load obtain with LS-DYNA, the drop-impact fracture cycles were predicted. The study was performed using a Sn-3.0Ag-0.5Cu solder (305 composition). To verify the reliability of the proposed analytical method, the results of the drop-impact tests and life-time analysis were compared, and were found to be in good agreement. Thus, the new analytical method was shown to be very useful and effective.
| Translated title of the contribution | Prediction of Impact Life Time in Solder Balls of the Board Level Flip Chips by Drop Simulations |
|---|---|
| Original language | Korean |
| Pages (from-to) | 237-242 |
| Number of pages | 6 |
| Journal | 한국생산제조시스템학회지 |
| Volume | 23 |
| Issue number | 3 |
| DOIs | |
| State | Published - Jun 2014 |