Abstract
To prepare the Cu-based filler material indicating enhanced oxidation resistance property and Ag content, Ag-coated Cu particles was fabricated by Ag plating of 40 wt % on the spherical Cu particles with an average size of 2 μm and their oxidation behavior was also evaluated. In the case that ethylenediaminetetraacetic acid was used alone, the fabricated particles frequently showed broken structures such as delamination at Ag shell/core Cu interface and hollow structure that are induced by excessive galvanic displacement reaction. As a result, fraction of defect particles increased up to 19.88% after the Ag plating of 40 wt.%. However, the fraction in the 40 wt.% Ag-coated Cu particles decreased to 9.01% and relatively smooth surface and dense microstructure in the Ag shell were also observed with additional usage of hydroquinone as a complexing agent. Ag-coated Cu particles having the enhanced microstructure did not show any weight increase by oxidation for exposure to air at 160oC for 2 h, indicating increased oxidation resistance property.
Translated title of the contribution | Preparation of 40 wt.% Ag-coated Cu Particles with Thick Ag Shells and Suppression of Defects in the Particles |
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Original language | Korean |
Pages (from-to) | 65-71 |
Number of pages | 7 |
Journal | 마이크로전자 및 패키징학회지 |
Volume | 24 |
Issue number | 4 |
DOIs | |
State | Published - Dec 2017 |