Abstract
In this paper, we have studied an efficient fabrication method that can produce a microscale dimple array at one instance by striking the workpiece with a thin metallic flyer accelerated by laser-induced plasma. Because the workpiece was embossed with the high-speed impact of the flyer, the benefits of high-speed processing, such as improved formability, could be realized. The effects of the laser-beam size, relative ratio of the laser-beam size to the flyer diameter, and flyer thickness on the forming performance were examined. It was found that, when the laser-beam size was smaller than the mold shape, the manufacturing performance was significantly lowered. To ensure the uniformity of the embossing dimples, it was more effective to increase the flyer speed by reducing the flyer thickness, rather than the diameter. Future research is needed to determine the optimal process conditions to improve the homogeneity of the dimple array.
| Translated title of the contribution | Patterning and Characterization of Micro-dimple Arrays on Metallic Surfaces by Laser-accelerated Flyer Impact |
|---|---|
| Original language | Korean |
| Pages (from-to) | 20-26 |
| Number of pages | 7 |
| Journal | 한국생산제조학회지 |
| Volume | 27 |
| Issue number | 1 |
| DOIs | |
| State | Published - Feb 2018 |