Abstract
The demand for multi-functionality, high density, high performance, and miniaturization of IC devices has caused the technology paradigm shift for electronic packaging. So, thermal management of new packaged chips becomes a bottleneck for the performance of next generation devices. Among various thermal solutions such as heat sink, heat spreader, TIM, thermoelectric cooler, etc. on-chip liquid cooling module was investigated in this study. Micro-channel was fabricated on Si wafer using a deep reactive ion etching, and 3 different micro-channel designs (straight MC, serpentine MC, zigzag MC) were formed to evalute the effectiveness of liquid cooling. At the heating temperature of 200oC and coolant flow rate of 150ml/min, straight MC showed the high temperature differential of ~44oC after liquid cooling. The shape of liquid flowing through micro-channel was observed by fluorescence microscope, and the temperarue differential of liquid cooling module was measuremd by IR microscope.
| Translated title of the contribution | Study of On-chip Liquid Cooling in Relation to Micro-channel Design |
|---|---|
| Original language | Korean |
| Pages (from-to) | 31-36 |
| Number of pages | 6 |
| Journal | 마이크로전자및패키징학회지 |
| Volume | 22 |
| Issue number | 4 |
| DOIs | |
| State | Published - Dec 2015 |