모바일 기기에 적용되는 초박형 패키지의 휨 현상

Translated title of the contribution: Wrapage Study of Ultra Thin Package Used in Mobile Devices

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Translated title of the contribution	Wrapage Study of Ultra Thin Package Used in Mobile Devices
Original language	Korean
Pages (from-to)	20-24
Number of pages	5
Journal	대한용접접합학회지
Volume	29
Issue number	1
State	Published - Feb 2011

Access to Document

@article{c54f3c12067d45de8336e636cd4db769,

title = "모바일 기기에 적용되는 초박형 패키지의 휨 현상",

author = "Choa, \{Sung Hoon\}",

year = "2011",

month = feb,

language = "Korean",

volume = "29",

pages = "20--24",

journal = "대한용접접합학회지",

issn = "1225-6153",

publisher = "대한용접접합학회",

number = "1",

}