Abstract
This paper describes the thermal fatigue life prediction models for 95.5Sn-4.0Ag-0.5Cu solder joints of Flip chip package considering Under Bump Metallurgy(UBM). A 3D Finite element slice model was used to simulate the viscoplastic behavior of the solder. For two types of solder bump pitches, simulations were analyzed and the effects of underfill packages were studied. Consequently, it was found out that solder joints with underfill had much better fatigue life than solder joints without underfill, and solder joints with 300μm bump pitch had a longer thermal fatigue life than solder joints with 150μm bump pitch. Through the simulations, flip chip with lead-free solder joints should be designed with underfill and a longer bump pitch.
| Translated title of the contribution | Simulation of Thermal Fatigue Life Prediction of Flip Chip with Lead-free Solder Joints by Variation in Bump Pitch and Underfill |
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| Original language | Korean |
| Pages (from-to) | 157-162 |
| Number of pages | 6 |
| Journal | 한국공작기계학회지 |
| Volume | 19 |
| Issue number | 2 |
| State | Published - Apr 2010 |