무연 솔더 접합부을 갖는 플립칩에서의 언더필 및 범프 피치 변화에 의한 열 피로 수명 예측 해석

Translated title of the contribution: Simulation of Thermal Fatigue Life Prediction of Flip Chip with Lead-free Solder Joints by Variation in Bump Pitch and Underfill

Research output: Contribution to journal › Article › peer-review

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