무전해 도금에 의한 은코팅 구리 플레이크의 제조에서전처리 공정 및 환원제 양의 영향

Translated title of the contribution: Effects of Different Pretreatment Methods and Amounts of Reductant on Preparation of Silver-coated Copper Flakes Using Electroless Plating

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Abstract

In the preparation of Ag-coated Cu flakes using L-ascorbic acid as a reductant for the electroless Ag plating, the effects of pretreatment methods and the reductant concentration on the uniformity of Ag coating layer and the antioxidation property of Ag-coated Cu flakes during the heating in air were evaluated. It was found that the removal degree of surface oxide layer during the pretreatment has great influence on the uniformity of Ag coating layer and the formation degree of hole defects in the flakes has slight effect on the anti-oxidation property of Ag-coated Cu flakes. It was also verified that the reductant concentration has great influence on the coverage uniformity and thickness of Ag coating, thus it was could be considered a main process parameter. When the reductant concentration was 0.04 M, high-quality Agcoated Cu flakes was obtained. When the concentration increased to 0.06 M, however, the anti-oxidation property of Agcoated Cu flakes became remarkably worse owing to remnant of Cu surface non-coated with Ag by the formation of pure Ag fine particles.
Translated title of the contributionEffects of Different Pretreatment Methods and Amounts of Reductant on Preparation of Silver-coated Copper Flakes Using Electroless Plating
Original languageKorean
Pages (from-to)97-104
Number of pages8
Journal마이크로전자 및 패키징학회지
Volume23
Issue number2
DOIs
StatePublished - Jun 2016

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