솔더 나노입자를 사용한 TSV Interconnection 기술

Translated title of the contribution: TSV Interconnection Technology using Solder Nanoparticles

Research output: Contribution to journal › Article › peer-review

Translated title of the contribution	TSV Interconnection Technology using Solder Nanoparticles
Original language	Korean
Pages (from-to)	27-34
Number of pages	8
Journal	대한용접접합학회지
Volume	29
Issue number	3
DOIs	https://doi.org/10.5781/KWJS.2011.29.3.283
State	Published - Jun 2011

Access to Document

@article{9d4eb70e704c4135a31e8d124fc0d7cc,

title = "솔더 나노입자를 사용한 TSV Interconnection 기술",

author = "Lee, \{Jong Hyun\}",

year = "2011",

month = jun,

doi = "10.5781/KWJS.2011.29.3.283",

language = "Korean",

volume = "29",

pages = "27--34",

journal = "대한용접접합학회지",

issn = "1225-6153",

publisher = "대한용접접합학회",

number = "3",

}