솔더 인터커넥터를 이용한 3차원 TSV 패키지의 신뢰성 연구

Translated title of the contribution: Reliability Study of 3D TSV Package Using Solder Interconnect

Sung Hoon Choa

Research output: Contribution to journal › Article › peer-review

Translated title of the contribution	Reliability Study of 3D TSV Package Using Solder Interconnect
Original language	Korean
Pages (from-to)	301-306
Number of pages	6
Journal	대한용접접합학회지
Volume	29
Issue number	3
DOIs	https://doi.org/10.5781/KWJS.2011.29.3.301
State	Published - Jun 2011

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@article{8f49964d5fbc404abf033b0eeeb27853,

title = "솔더 인터커넥터를 이용한 3차원 TSV 패키지의 신뢰성 연구",

author = "Choa, \{Sung Hoon\}",

year = "2011",

month = jun,

doi = "10.5781/KWJS.2011.29.3.301",

language = "Korean",

volume = "29",

pages = "301--306",

journal = "대한용접접합학회지",

issn = "1225-6153",

publisher = "대한용접접합학회",

number = "3",

}