Abstract
In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters,the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.
| Translated title of the contribution | Improvement of Filling Characteristics of Micro-Bumps in the Stencil Printing Process |
|---|---|
| Original language | Korean |
| Pages (from-to) | 26-32 |
| Number of pages | 7 |
| Journal | 한국생산제조시스템학회지 |
| Volume | 21 |
| Issue number | 1 |
| DOIs | |
| State | Published - Feb 2012 |