아산화동과 황산간의 고속 화학반응에 의한 미세 Cu 입자의 합성과 삼본밀에 의한 분산성 개선

With the aim of using a filler material in a conductive paste, fine Cu nanoparticles were synthesized through the high-speed chemical reaction between cuprous oxide (Cu2O) powder and sulfuric acid in distilled water. Under external temperature of 7oC, sulfuric acid concentration of 48%, and Cu2O amount of 30 g, the Cu2O particles were eliminated and slightly aggregated Cu nanoparticles were synthesized. Futhermore, Cu nanoparticles of 224 nm, in which the aggregation between particles was obviousiy much suppressed, were synthesized with the choice of an additive. In the particle sample, occasionally there are coarse particles formed by the aggregation of fine nanoparticles and weak linkages between the nanoparticles. However, the coarse particles were destroyed and the linkages were broken after mixing with a resin formulation, indicating the behavior of untangling the aggregation between nanoparticles.