Abstract
As transistor density increases rapidly, a heat flux from IC device rises at fast rate. Thermal issues raised by high heat flux cause IC's performance and reliability problems. To solve these thermal management problems, the conventional cooling methods of IC devices were reached their thermal limit. As a result, alternative cooling methods such as liquid heat pipe, thermoelectric cooler, thermal Si via and etc. are currently emerging. In this paper microchannel liquid cooling system with TSV was investigated. The effects of 2 coolants (DI water and ethylene glycol 70 wt%) and 3 metal bumps (Ag, Cu, Cr/Au/Cu) on cooling performance were studied, and the total heat flux of various coolant and bump cases were compared. Surface temperature of liquid cooling system was measured by infrared microscopy, and liquid flowing through microchannel was observed by fluorescence microscope. In the case of ethylene glycol 70 wt% at 200oC heating temperature, the total heat flux was 2.42 W/cm2 and most of total heat flux was from liquid cooling effect.
| Translated title of the contribution | Effect of Coolants and Metal Bumps on the heat Removal of Liquid Cooled Microchannel System |
|---|---|
| Original language | Korean |
| Pages (from-to) | 61-67 |
| Number of pages | 7 |
| Journal | 마이크로전자 및 패키징학회지 |
| Volume | 24 |
| Issue number | 2 |
| DOIs | |
| State | Published - Jun 2017 |