Skip to main navigation
Skip to search
Skip to main content
Seoul National University of Science & Technology Home
Search content at Seoul National University of Science & Technology
Home
Profiles
Research units
Research output
액랭식 마이크로채널 시스템 내 냉매와 범프의 열 제거 효과에 대한 연구
Translated title of the contribution
:
Effect of Coolants and Metal Bumps on the heat Removal of Liquid Cooled Microchannel System
Sarah Eunkyung Kim
,
Sung Dong Kim
Dept. of Semiconductor Engineering
School of Mechanical Systems Engineering/ Intelligent Robotics Engineering
Research output
:
Contribution to journal
›
Article
›
peer-review
Overview
Fingerprint
Fingerprint
Dive into the research topics of 'Effect of Coolants and Metal Bumps on the heat Removal of Liquid Cooled Microchannel System'. Together they form a unique fingerprint.
Sort by
Weight
Alphabetically
Engineering
Microchannel
100%
Heat Flux
100%
Cooling System
40%
Thermoelectricity
20%
Heat Pipe
20%
Cooling Performance
20%