Abstract
Drop simulations of the board level in the flip chips with solder joints have been highlighted for years, recently. Also,through the study on the life prediction of thermal fatigue in the flip chips considering underfill, its importance has been issued greatly. In this paper, dynamic analysis using the implicit method in the Finite Element Analysis (FEA) is carried out to assess the factors effecting on flip chips considering underfill. The design parameters are size and thickness of chip,and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard is modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. Modal analysis is simulated to find out the relation between drop impact and vibration of the board system.
| Translated title of the contribution | Board Level Drop Simulations and Modal Analysis in the Flip Chips with Solder Balls of Sn-1.0Ag-0.5Cu Considering Underfill |
|---|---|
| Original language | Korean |
| Pages (from-to) | 225-231 |
| Number of pages | 7 |
| Journal | 한국생산제조시스템학회지 |
| Volume | 21 |
| Issue number | 2 |
| DOIs | |
| State | Published - Apr 2012 |