Abstract
With the simplicity of process and high reliability in chip or package bonding, epoxy solder paste (ESP)has been recently considered as a competitive bonding material. The ESP material is composed of solderpowder and epoxy formulation which can remove oxide layers on the surface of solder powder and padfinish metal. The bonding formed using ESP shows outstanding bonding strength and suppresses electricalshort between adjacent pads or leads owing to the reinforced structure by cured epoxy after the bonding.
ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With thementioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly offlexible electronics and electronic modules in automotive vehicles.
ESP is also expected to suppress the formation and growth of whisker on the pads or leads. With thementioned advantages, ESP is anticipated to become a spotlighted bonding material in the assembly offlexible electronics and electronic modules in automotive vehicles.
| Translated title of the contribution | Epoxy solder paste and its applications |
|---|---|
| Original language | Korean |
| Pages (from-to) | 32-39 |
| Number of pages | 8 |
| Journal | 대한용접접합학회지 |
| Volume | 33 |
| Issue number | 3 |
| DOIs | |
| State | Published - Jun 2015 |