웨이퍼 레벨 패키지 공정의 웨이퍼 크기변화에 따른 최적화 설계

Recently the wafer size migration from 12" (300 mm) to 18" (450 mm) for the industry cost reduction can be achieved. Because it requires better thin film deposition property and the larger process compatibility. Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and crack are major concerns for semiconductor manufacturing. We optimized the 12” and 18” wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.