유연기판 위에 제작된 Silver Nanowire 필름의 기계 및 전기적 신뢰성 연구

Translated title of the contribution: Mechanical and Electrical Reliability of Silver Nanowire Film on Flexible Substrate

Research output: Contribution to journalArticlepeer-review

Abstract

In this paper, we investigated the mechanical and electrical reliability of silver nanowire (AgNW) films. In particular, the durability and reliability of AgNW films were studied when the AgNW film was subjected to the bending deformation under current flow. The electrical durability of AgNW was evaluated by observing changes in heat generation and current density occurring in AgNW through voltage and current tests. The AgNW film showed a constant resistance change up to a bending radius of 2 mm and 200,000 cycles in the bending fatigue tests. The over-coating layer has an effect of improving the durability of the AgNW film. In the case of AgNW with the over-coating layer, heat was uniformly dissipated on the surface of AgNW film, whereas in the case of AgNW film without the over-coating layer, heat was generated locally. In the bending test under the current flow, the current density of the AgNW film was continuously decreased up to 52.4%. During bending, the AgNW was deformed due to mechanical deformation such as tensile, bending and sliding of the AgNW, consequently contact resistance of the AgNW was increased, leading to a electrical breakdown of AgNW by Joule heating. It was found that the application of the over-coating layer can improve the electrical and mechanical reliability of the AgNW film.
Translated title of the contributionMechanical and Electrical Reliability of Silver Nanowire Film on Flexible Substrate
Original languageKorean
Pages (from-to)93-99
Number of pages7
Journal마이크로전자 및 패키징학회지
Volume23
Issue number4
DOIs
StatePublished - Dec 2016

Fingerprint

Dive into the research topics of 'Mechanical and Electrical Reliability of Silver Nanowire Film on Flexible Substrate'. Together they form a unique fingerprint.

Cite this