Abstract
Micro-LED is a light-emitting diode smaller than 100 μm in size. It attracts much attention due to its superior performance, such as resolution, brightness, etc., and is considered for various applications like flexible display and VR/ AR. Micro-LED display requires a mass transfer process to move micro-LED chips from a LED wafer to a target substrate.
In this study, we proposed a vacuum chuck method as a mass transfer technique. The vacuum chuck was fabricated with MEMS technology and PDMS micro-mold process. The spin-coating approach using a dam structure successfully controlled the PDMS mold's thickness. The vacuum test using solder balls instead of micro-LED confirmed the vacuum chuck method as a mass transfer technique.
In this study, we proposed a vacuum chuck method as a mass transfer technique. The vacuum chuck was fabricated with MEMS technology and PDMS micro-mold process. The spin-coating approach using a dam structure successfully controlled the PDMS mold's thickness. The vacuum test using solder balls instead of micro-LED confirmed the vacuum chuck method as a mass transfer technique.
| Translated title of the contribution | Micro-LED Mass Transfer using a Vacuum Chuck |
|---|---|
| Original language | Korean |
| Pages (from-to) | 121-127 |
| Number of pages | 7 |
| Journal | 마이크로전자 및 패키징학회지 |
| Volume | 29 |
| Issue number | 2 |
| DOIs | |
| State | Published - Jun 2022 |