첨단 반도체 패키징 적용을 위한 DPSS 레이저를 이용한 디본딩 메커니즘 연구

There has been an increase in demand for the development of laser debonding technology for application to temporary bonding and debonding in advanced semiconductor packaging. Laser debonding has a lot of advantages such as contactless, low device damage, large-scale manufacturing, and rapid processing time. Although several researches have explored feasibility tests for laser debonding using ultra-violet diode pumped solid-state (UV DPSS) laser, debonding mechanism was less reported. Herein, laser debonding was carried out using UV DPSS nanosecond pulse laser and galvanometer scanner system. Debonding fluence about temporary bonding materials by BrewerBOND was investigated and debonding mechanism was studied with heat transfer simulation. In addition, debonding feasibility tests with 12 inch wafer were also performed, but some debris were observed. Our study indicates that optimization of laser fluence and material structure are necessary to minimize debris and damage and it shows a potential possibility for application in advanced packaging of ultra-thin wafer.