초음파 진동과 레이저 후면 에칭을 통한 유리 구멍 가공

Translated title of the contribution: Glass Drilling using Laser-induced Backside Wet Etching with Ultrasonic Vibration

Research output: Contribution to journalArticlepeer-review

Abstract

Laser beam machining has been known as efficient for glass micromachining. It is usually used the ultra-short pulsed laser which is time-consuming and uneconomic process. In order to use economic and powerful long pulsed laser, indirect processing called laser-induced backside wet etching (LIBWE) is good alternative method. In this paper, micromachining of glass using Nd:YAG laser with nanosecond pulsed beam has been attempted. In order to improve shape accuracy, combined processing with magnetic stirrer has been widely used. Magnetic stirrer acts to circulate the solution and remove the bubble but it is not suitable for deep hole machining. To get better effect, ultrasonic vibration was applied for improving shape accuracy
Translated title of the contributionGlass Drilling using Laser-induced Backside Wet Etching with Ultrasonic Vibration
Original languageKorean
Pages (from-to)75-81
Number of pages7
Journal한국정밀공학회지
Volume31
Issue number1
DOIs
StatePublished - Jan 2014

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