Abstract
The need for drop simulations for board-leveled flip chips in micro-system packaging has been increasing. There have been many studies on flip chips with various solder ball compositions. However, studies on flip chips with Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu have rarely been attempted because of the unknown material properties. According to recent studies, drop simulations with these solder ball compositions have proven feasible. In this study, predictions of the impact lifetime by drop simulations are performed considering Cu and Cu/Ni UBMs using LS-DYNA to alter the design parameters of the flip chips, such as thickness of the flip chip and size of the solder ball. It was found that a smaller chip thickness, larger solder ball diameter, and using the Cu/Ni UBM can improve the drop lifetime of solder balls.
| Translated title of the contribution | Prediction of the Impact Lifetime for Board-Leveled Flip Chips by Changing the Design Parameters of the Solder Balls |
|---|---|
| Original language | Korean |
| Pages (from-to) | 117-123 |
| Number of pages | 7 |
| Journal | 한국생산제조시스템학회지 |
| Volume | 24 |
| Issue number | 1 |
| DOIs | |
| State | Published - Feb 2015 |