Abstract
A 32-KB standard CMOS antifuse one-time programmable (OTP) ROM embedded in a 16-bit microcontroller as its program memory is designed and implemented in 0.18-μm standard CMOS technology. The proposed 32-KB OTP ROM cell array consists of 4.2 μm2 three-transistor (3T) OTP cells where each cell utilizes a thin gate-oxide antifuse, a high-voltage blocking transistor, and an access transistor, which are all compatible with standard CMOS process. In order for high density implementation, the size of the 3T cell has been reduced by 80% in comparison to previous work. The fabricated total chip size, including 32-KB OTP ROM, which can be programmed via external I2C master device such as universal I2C serial EEPROM programmer, 16-bit microcontroller with 16-KB program SRAM and 8-KB data SRAM, peripheral circuits to interface other system building blocks, and bonding pads, is 9.9 mm 2. This paper describes the cell, design, and implementation of high-density CMOS OTP ROM, and shows its promising possibilities in embedded applications.
| Original language | English |
|---|---|
| Article number | 1683903 |
| Pages (from-to) | 2115-2124 |
| Number of pages | 10 |
| Journal | IEEE Journal of Solid-State Circuits |
| Volume | 41 |
| Issue number | 9 |
| DOIs | |
| State | Published - Sep 2006 |
Keywords
- CMOS antifuse
- CMOS OTP
- Embedded PROM
- Gate-oxide breakdown
- Microcontroller
- Nonvolatile memory
- OTP ROM
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