TY - GEN
T1 - A 32Gb MLC NAND-flash memory with Vth-endurance-enhancing schemes in 32nm CMOS
AU - Lee, Changhyuk
AU - Lee, Sok Kyu
AU - Ahn, Sunghoon
AU - Lee, Jinhaeng
AU - Park, Wonsun
AU - Cho, Yongdeok
AU - Jang, Chaekyu
AU - Yang, Chulwoo
AU - Chung, Sanghwa
AU - Yun, In Suk
AU - Joo, Byoungin
AU - Jeong, Byoungkwan
AU - Kim, Jeeyul
AU - Kwon, Jaekwan
AU - Jin, Hyunjong
AU - Noh, Yujong
AU - Ha, Jooyun
AU - Sung, Moonsoo
AU - Choi, Daeil
AU - Kim, Sanghwan
AU - Choi, Jeawon
AU - Jeon, Taeho
AU - Yang, Joong Seob
AU - Koh, Yo Hwan
PY - 2010
Y1 - 2010
N2 - As NAND flash memory market grows rapidly in various application such as USB devices, MP3 players, SSD, cellular phone, cameras, there is a strong requirement of high density and low cost devices. Two different approaches studied to meet these requirements are increasing data per cell and scaling down. 3b/cell or 4b/cell NAND flash memories were introduced as an effective way to lower cost [1,2]. However, these devices suffer from significant program performance degradation since tighter Vth distribution is required. On the other hand, scaling down can be a candidate to achieve low cost while maintaining high program performance even though there are several hurdles to overcome such as floating gate (FG) coupling and charge retention [3].
AB - As NAND flash memory market grows rapidly in various application such as USB devices, MP3 players, SSD, cellular phone, cameras, there is a strong requirement of high density and low cost devices. Two different approaches studied to meet these requirements are increasing data per cell and scaling down. 3b/cell or 4b/cell NAND flash memories were introduced as an effective way to lower cost [1,2]. However, these devices suffer from significant program performance degradation since tighter Vth distribution is required. On the other hand, scaling down can be a candidate to achieve low cost while maintaining high program performance even though there are several hurdles to overcome such as floating gate (FG) coupling and charge retention [3].
UR - http://www.scopus.com/inward/record.url?scp=77952147387&partnerID=8YFLogxK
U2 - 10.1109/ISSCC.2010.5433932
DO - 10.1109/ISSCC.2010.5433932
M3 - Conference contribution
AN - SCOPUS:77952147387
SN - 9781424460342
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 446
EP - 447
BT - 2010 IEEE International Solid-State Circuits Conference, ISSCC 2010 - Digest of Technical Papers
T2 - 2010 IEEE International Solid-State Circuits Conference, ISSCC 2010
Y2 - 7 February 2010 through 11 February 2010
ER -