TY - GEN
T1 - A Co-Integrated Optical Phased Array, Mach-Zehnder Modulator and Mm-Wave Driver for Free-Space Communication
AU - Kim, Youngin
AU - Kulmer, Laurenz
AU - Keller, Killian
AU - Park, Jeongsoo
AU - Abdelmagid, Basem Abdelaziz
AU - Choi, Kyung Sik
AU - Lee, Dongwon
AU - Liu, Yuqi
AU - Leuthold, Juerg
AU - Wang, Hua
N1 - Publisher Copyright:
© 2024 IEEE.
PY - 2024
Y1 - 2024
N2 - Fully integrated silicon-based optical phased arrays (OPAs) are promising devices due to their extremely narrow beam, compact size, and low power consumption. Their potential applications include light detection and ranging (LiDAR), three-dimensional (3D) imaging, holography and wireless optical communication (WOC) [1]-[6]. These applications require OPAs to have small size and efficient interfacing between the electronic and photonic integrated circuits (ICs). There have been substantial efforts to realize compact OPAs with CMOS ICs for LiDAR applications [2-3, 5]. [2] demonstrated a monolithic integration with 1024-element antennas and DACs into one single chip, and [3] employed 3D-integration to connect phase shifters in the OPA with DACs. For the interface between the phase shifters and their driving DACs, relatively low bandwidth (BW) signals below 200 MHz are sufficient [1]. In contrast, OPAs for WOC require broadband electrical driving signal up-to 30 Gbps from an RF-amplifier to a traveling-wave-electrode Mach-Zehnder modulator (TWE-MZM) [4]. For such broadband high frequencies, the electronic-to-photonic IC interface becomes highly vulnerable to parasitics, losses, and impedance mismatches. As a result, OPAs for high-speed WOC applications have only been presented using commercial MZMs and RF-amplifiers, which consume large area and power, as shown in Fig. 1 [4]-[6].
AB - Fully integrated silicon-based optical phased arrays (OPAs) are promising devices due to their extremely narrow beam, compact size, and low power consumption. Their potential applications include light detection and ranging (LiDAR), three-dimensional (3D) imaging, holography and wireless optical communication (WOC) [1]-[6]. These applications require OPAs to have small size and efficient interfacing between the electronic and photonic integrated circuits (ICs). There have been substantial efforts to realize compact OPAs with CMOS ICs for LiDAR applications [2-3, 5]. [2] demonstrated a monolithic integration with 1024-element antennas and DACs into one single chip, and [3] employed 3D-integration to connect phase shifters in the OPA with DACs. For the interface between the phase shifters and their driving DACs, relatively low bandwidth (BW) signals below 200 MHz are sufficient [1]. In contrast, OPAs for WOC require broadband electrical driving signal up-to 30 Gbps from an RF-amplifier to a traveling-wave-electrode Mach-Zehnder modulator (TWE-MZM) [4]. For such broadband high frequencies, the electronic-to-photonic IC interface becomes highly vulnerable to parasitics, losses, and impedance mismatches. As a result, OPAs for high-speed WOC applications have only been presented using commercial MZMs and RF-amplifiers, which consume large area and power, as shown in Fig. 1 [4]-[6].
UR - http://www.scopus.com/inward/record.url?scp=85193964199&partnerID=8YFLogxK
U2 - 10.1109/CICC60959.2024.10529031
DO - 10.1109/CICC60959.2024.10529031
M3 - Conference contribution
AN - SCOPUS:85193964199
T3 - Proceedings of the Custom Integrated Circuits Conference
BT - 2024 IEEE Custom Integrated Circuits Conference, CICC 2024 - Proceedings
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 44th Annual IEEE Custom Integrated Circuits Conference, CICC 2024
Y2 - 21 April 2024 through 24 April 2024
ER -