A contact detection algorithm of the z-axis of a wire bonder

Jung Han Kim; Hee Jae Park

doi:10.1016/j.conengprac.2005.06.004

A contact detection algorithm of the z-axis of a wire bonder

Dept. of Mechanical System and Design Engineering

Research output: Contribution to journal › Article › peer-review

11 Scopus citations

Abstract

A new design of contact detection algorithm is proposed for the z-axis of a wire bonder that interconnects between pads and leads in semiconductor manufacturing processes. The proposed test parameter for contact detection is statistically designed using the relation between Kalman filter propagations, and it has a simple process for defining probability of false alarm. Fast and stable contact detection of the z-axis is extremely important for maintaining proper quality in the fine pitch gold wire bonding process, which has a small pad size of below 70 μm. Experimental results are presented to demonstrate the advantages of the proposed algorithm.

Original language	English
Pages (from-to)	1035-1043
Number of pages	9
Journal	Control Engineering Practice
Volume	14
Issue number	9
DOIs	https://doi.org/10.1016/j.conengprac.2005.06.004
State	Published - Sep 2006

Keywords

Detecting elements
Detection algorithms
Filtering problem
Kalman filters
Modeling errors
Stochastic parameters

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

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10.1016/j.conengprac.2005.06.004

Cite this

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title = "A contact detection algorithm of the z-axis of a wire bonder",

abstract = "A new design of contact detection algorithm is proposed for the z-axis of a wire bonder that interconnects between pads and leads in semiconductor manufacturing processes. The proposed test parameter for contact detection is statistically designed using the relation between Kalman filter propagations, and it has a simple process for defining probability of false alarm. Fast and stable contact detection of the z-axis is extremely important for maintaining proper quality in the fine pitch gold wire bonding process, which has a small pad size of below 70 μm. Experimental results are presented to demonstrate the advantages of the proposed algorithm.",

keywords = "Detecting elements, Detection algorithms, Filtering problem, Kalman filters, Modeling errors, Stochastic parameters",

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AU - Kim, Jung Han

AU - Park, Hee Jae

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AB - A new design of contact detection algorithm is proposed for the z-axis of a wire bonder that interconnects between pads and leads in semiconductor manufacturing processes. The proposed test parameter for contact detection is statistically designed using the relation between Kalman filter propagations, and it has a simple process for defining probability of false alarm. Fast and stable contact detection of the z-axis is extremely important for maintaining proper quality in the fine pitch gold wire bonding process, which has a small pad size of below 70 μm. Experimental results are presented to demonstrate the advantages of the proposed algorithm.

KW - Detecting elements

KW - Detection algorithms

KW - Filtering problem

KW - Kalman filters

KW - Modeling errors

KW - Stochastic parameters

UR - https://www.scopus.com/pages/publications/33645846599

U2 - 10.1016/j.conengprac.2005.06.004

DO - 10.1016/j.conengprac.2005.06.004

M3 - Article

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SN - 0967-0661

VL - 14

SP - 1035

EP - 1043

JO - Control Engineering Practice

JF - Control Engineering Practice

IS - 9

ER -

A contact detection algorithm of the z-axis of a wire bonder

Abstract

Keywords

UN SDGs

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