TY - GEN
T1 - A microfabricated neural probe with porous si-parylene hybrid structure to enable a reliable brain-machine interface
AU - Sun, Tao
AU - Merugu, Srinivas
AU - Tsang, Wei Mong
AU - Park, Woo Tae
AU - Xue, Ning
AU - Liu, Yunxiao
AU - Han, Beibei
AU - Dawe, Gavin
AU - Gu, Alex Yuandong
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/2/26
Y1 - 2016/2/26
N2 - To establish a reliable brain-machine interface (BMI), we report for the first time, a multifunctional porous silicon (PSi)-parylene neural probe using a CMOS compatible fabrication process. The biodegradable PSi shank serves as a mechanical stiffener for insertion process, then dissolves to leave only the polymeric structure to reduce stiffness mismatch between implant and cortical tissue, thus attenuates tissue responses. Moreover, its porous structure can serve as drug reservoir. The healing of the insertion trauma can be enhanced by continuously releasing pre-loaded drugs with the PSi degradation. Hence, the neural probe enables a more reliable BMI.
AB - To establish a reliable brain-machine interface (BMI), we report for the first time, a multifunctional porous silicon (PSi)-parylene neural probe using a CMOS compatible fabrication process. The biodegradable PSi shank serves as a mechanical stiffener for insertion process, then dissolves to leave only the polymeric structure to reduce stiffness mismatch between implant and cortical tissue, thus attenuates tissue responses. Moreover, its porous structure can serve as drug reservoir. The healing of the insertion trauma can be enhanced by continuously releasing pre-loaded drugs with the PSi degradation. Hence, the neural probe enables a more reliable BMI.
UR - https://www.scopus.com/pages/publications/84970949929
U2 - 10.1109/MEMSYS.2016.7421581
DO - 10.1109/MEMSYS.2016.7421581
M3 - Conference contribution
AN - SCOPUS:84970949929
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 153
EP - 156
BT - MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Y2 - 24 January 2016 through 28 January 2016
ER -