A Miniaturized Thin-Film UWB Monopole Antenna Implemented with High-Dk Adhesive

This paper presents the design of a miniaturized polyimide-based antenna for ultra-wideband (UWB) communication. Miniaturization is achieved through the utilization of adhesive material with a high dielectric constant (high-Dk). The goal of this work is to investigate the impact of such material on the antenna performance and to optimize its design for UWB operation. The manufacturing of the antenna using the proposed structure is developed, and the prototype of an antenna for the UWB high band (6–9 GHz) is measured and analyzed. By leveraging the high Dk of the adhesive material, the simulation and measurement results show that the proposed antenna with a high-Dk adhesive film can achieve compact dimensions with good performance in terms of the gain and time domain characteristics. The results of this study show the potential of exhibiting a reduction in the size of the antenna and will contribute to the advancement of miniaturized UWB antenna technology.