A shutter-less micro-bolometer thermal imaging system using multiple digital correlated double sampling for mobile applications

Seunghyun Park, Tei Cho, Minsik Kim, Hyungchul Park, Kwyro Lee

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

12 Scopus citations

Abstract

A micro-bolometer focal plane array (MBFPA)-based long wavelength Infra-red thermal imaging sensor is presented. The proposed multiple digital correlated double sampling (MD-CDS) readout method employing newly designed reference-cell greatly reduces PVT variation-induced fixed pattern noise (FPN) and as a result features much relaxed calibration process, easier TEC-less operation and Shutter-less operation. The readout IC and MBFPA was fabricated in 0.35um CMOS and amorphous silicon MEMS process respectively. The fabricated MBFPA thermal imaging sensor has NETD performance of 0.1 kelvin even though the mechanical shutter is not used.

Original languageEnglish
Title of host publication2017 Symposium on VLSI Technology, VLSI Technology 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
PagesC154-C155
ISBN (Electronic)9784863486058
DOIs
StatePublished - 31 Jul 2017
Event37th Symposium on VLSI Technology, VLSI Technology 2017 - Kyoto, Japan
Duration: 5 Jun 20178 Jun 2017

Publication series

NameDigest of Technical Papers - Symposium on VLSI Technology
ISSN (Print)0743-1562

Conference

Conference37th Symposium on VLSI Technology, VLSI Technology 2017
Country/TerritoryJapan
CityKyoto
Period5/06/178/06/17

Keywords

  • correlated double sampling
  • MEMS
  • Micro-bolometer
  • shutter-less
  • thermal imagers

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