TY - GEN
T1 - A Study on Flexibility Improvement of AMOLED Back Plane and Mask Reduction Process Architecture Using Photo-sensitive Organic Insulation Films
AU - Chung Guanghai Jin, In young
AU - Yoon, Hyunsik
N1 - Publisher Copyright:
© 2024 FTFMD.
PY - 2024
Y1 - 2024
N2 - In this work, the method of patterning inter-layer deposition (ILD) and passivation layer (PVX) of the AMOLED back plane structure with an organic film was studied. By replacing the inorganic film of SiNx + SiO2 with an organic film Poly-imide, back plane suitable for flexible AMOLED was secured. It was possible to secure equivalent TFT transfer characteristics of device compared to inorganic inter layer structure by applying low- temperature buffer and 2nd gate insulator SiNx to the organic inter layer TFT device. Also, VIA + passivation layer 2 mask photo process was replaced with 1 mask photo process using a VIA Half-tone mask. Both processes were able to secure a process architecture that can be applied to flexible and rollable displays in the future by using photo-sensitive organic insulation films.
AB - In this work, the method of patterning inter-layer deposition (ILD) and passivation layer (PVX) of the AMOLED back plane structure with an organic film was studied. By replacing the inorganic film of SiNx + SiO2 with an organic film Poly-imide, back plane suitable for flexible AMOLED was secured. It was possible to secure equivalent TFT transfer characteristics of device compared to inorganic inter layer structure by applying low- temperature buffer and 2nd gate insulator SiNx to the organic inter layer TFT device. Also, VIA + passivation layer 2 mask photo process was replaced with 1 mask photo process using a VIA Half-tone mask. Both processes were able to secure a process architecture that can be applied to flexible and rollable displays in the future by using photo-sensitive organic insulation films.
KW - Inter layer deposition (ILD)
KW - VIA Half-tone mask
UR - http://www.scopus.com/inward/record.url?scp=85203175935&partnerID=8YFLogxK
U2 - 10.23919/AM-FPD61635.2024.10615343
DO - 10.23919/AM-FPD61635.2024.10615343
M3 - Conference contribution
AN - SCOPUS:85203175935
T3 - 2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2024
SP - 191
EP - 194
BT - 2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices, AM-FPD 2024
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 31st International Workshop on Active-Matrix Flatpanel Displays and Devices: TFT Technologies and FPD Materials, AM-FPD 2024
Y2 - 2 July 2024 through 5 July 2024
ER -