TY - GEN
T1 - A study on optimization design of ultrasonic bonding machine
AU - Yoo, Jae Myung
AU - Kim, Jong Hyeong
PY - 2007
Y1 - 2007
N2 - Our life has many electronic products and its use getting increase sharply in the future. For this reason, importance of semiconductors packaging technology with small size, multi function has been a steady increase every day. So flip chip interconnection technology to satisfy the requirements is realized very important technology by many researchers and various study of the flip chip interconnection technologies such as process and technology of bonding, bumping and UBM process etc. are going on actively. The technology of bonding is classified into bonding process as thermo compression bonding, ultrasonic bonding and laser bonding. In this paper flip chip bonding machine using ultrasonic bonding process technology is developed. The bonding machine which can bond gold to gold and gold to aluminum using 40kHz ultrasonic. The machine is semi auto ultrasonic flip chip bonding machine. It consists of three units: 1. Bonding head unit of accurate structure for reliability 2. Panel stage unit of accurate actuator structure for velocity and force control 3. Align Camera unit consist of 2 CCD camera module and mirror type for align of COG.
AB - Our life has many electronic products and its use getting increase sharply in the future. For this reason, importance of semiconductors packaging technology with small size, multi function has been a steady increase every day. So flip chip interconnection technology to satisfy the requirements is realized very important technology by many researchers and various study of the flip chip interconnection technologies such as process and technology of bonding, bumping and UBM process etc. are going on actively. The technology of bonding is classified into bonding process as thermo compression bonding, ultrasonic bonding and laser bonding. In this paper flip chip bonding machine using ultrasonic bonding process technology is developed. The bonding machine which can bond gold to gold and gold to aluminum using 40kHz ultrasonic. The machine is semi auto ultrasonic flip chip bonding machine. It consists of three units: 1. Bonding head unit of accurate structure for reliability 2. Panel stage unit of accurate actuator structure for velocity and force control 3. Align Camera unit consist of 2 CCD camera module and mirror type for align of COG.
KW - Flip chip interconnection
KW - MSP(microsystems packaging) technology
KW - Ultrasonic bonding machine
UR - https://www.scopus.com/pages/publications/48349091441
U2 - 10.1109/ICCAS.2007.4406845
DO - 10.1109/ICCAS.2007.4406845
M3 - Conference contribution
AN - SCOPUS:48349091441
SN - 8995003871
SN - 9788995003879
T3 - ICCAS 2007 - International Conference on Control, Automation and Systems
SP - 2799
EP - 2803
BT - ICCAS 2007 - International Conference on Control, Automation and Systems
T2 - International Conference on Control, Automation and Systems, ICCAS 2007
Y2 - 17 October 2007 through 20 October 2007
ER -