TY - GEN
T1 - A Transfer Method for Embedding Conductive Fillers on the Surface of Multi-Scale Structures for 3D Flexible Conductors
AU - Yoo, Dongwoo
AU - Kim, Sangmok
AU - Hwang, Jeonghyeon
AU - Kim, Joonwon
N1 - Publisher Copyright:
© 2023 IEEE.
PY - 2023
Y1 - 2023
N2 - This paper demonstrates a transfer method for embedding conductive fillers (e.g., metal nanowires (MWs) and multi-walled carbon nanotubes (MWCNTs)) on the surface of polymers (e.g., polydimethylsiloxane (PDMS), polyurethane (PU)) with various multi-scale structures to fabricate 3D flexible conductors. Conductive fillers were embedded on the surfaces of macro- and microstructures considering the optimal surface energy conditions for transferring spray-coated conductive fillers from 3D molds to the polymer networks. This transfer method achieves highly conductive and robust 3D flexible conductors without changing the mechanical properties (e.g., elastic modulus, ductility, and brittleness), generating cracks in the conductive layer, or losing the conductive fillers under repeated pressure. Consequently, the developed conductors applied to pressure sensors exhibited sensing stability by maintaining a constant initial value.
AB - This paper demonstrates a transfer method for embedding conductive fillers (e.g., metal nanowires (MWs) and multi-walled carbon nanotubes (MWCNTs)) on the surface of polymers (e.g., polydimethylsiloxane (PDMS), polyurethane (PU)) with various multi-scale structures to fabricate 3D flexible conductors. Conductive fillers were embedded on the surfaces of macro- and microstructures considering the optimal surface energy conditions for transferring spray-coated conductive fillers from 3D molds to the polymer networks. This transfer method achieves highly conductive and robust 3D flexible conductors without changing the mechanical properties (e.g., elastic modulus, ductility, and brittleness), generating cracks in the conductive layer, or losing the conductive fillers under repeated pressure. Consequently, the developed conductors applied to pressure sensors exhibited sensing stability by maintaining a constant initial value.
UR - https://www.scopus.com/pages/publications/85149830436
U2 - 10.1109/MEMS49605.2023.10052193
DO - 10.1109/MEMS49605.2023.10052193
M3 - Conference contribution
AN - SCOPUS:85149830436
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 327
EP - 330
BT - 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems, MEMS 2023
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 36th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2023
Y2 - 15 January 2023 through 19 January 2023
ER -