A wafer-scale 3D IC technology platform using dielectric bonding glues and copper damascene patterned inter-wafer interconnects
- J. Q. Lu
- , Y. Kwon
- , G. Rajagopalan
- , M. Gupta
- , J. McMahon
- , K. W. Lee
- , R. P. Kraft
- , J. F. McDonald
- , T. S. Cale
- , R. J. Gutmann
- , B. Xu
- , E. Eisenbraun
- , J. Castracane
- , A. Kaloyeros
- Rensselaer Polytechnic Institute
- SUNY Albany
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review
33
Scopus
citations