Abstract
After the preparation of low-cost conductive paste containing Ag-coated Cu flakes, thermal conductivity and electrical resistivity of the paste were measured with different curing conditions. Under air-curing conditions, the thermal conductivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, the sample cured under nitrogen indicated more enhanced thermal conductivity than that cured under air, approaching that of paste containing pure Ag flakes. Under air-curing conditions, meanwhile, the electrical resistivity of the cured sample increased with an increase of curing time from 30 to 60 min. After identical curing time of 60 min, however, the sample cured under nitrogen indicated extremely enhanced electrical resistivity ($7.59{\times}10^{-5}{\Omega}{\cdot}cm$) in comparison with that cured under air.
| Translated title of the contribution | Electrical Resistivity and Thermal Conductivity of Paste Containing Ag-coated Cu Flake Filler |
|---|---|
| Original language | Korean |
| Pages (from-to) | 51-56 |
| Number of pages | 6 |
| Journal | 마이크로전자 및 패키징학회지 |
| Volume | 21 |
| Issue number | 4 |
| DOIs | |
| State | Published - Dec 2014 |