An integrated wafer-scale packaging process for MEMS
- Thomas W. Kenny
- , Rob N. Candler
- , Huimou J. Li
- , Woo Tae Park
- , Junghwa Cho
- , Holden Li
- , Aaron Partridge
- , Gary Yama
- , Marcus Lutz
Research output: Contribution to conference › Paper › peer-review
2
Scopus
citations