Analysis of a micro pattern forming on the thin sheet metal for electronic device

Roll-to-roll forming process is one of important metal processing technology because the process is simple and economical. These days, roll-to-roll forming process is tried to be employed in manufacturing the circuit board, barrier ribs and electric device panel. However, it is difficult to apply the roll-to-roll forming into the forming of micro scale or sub-micro scale cavities. In this study, the roll-to-roll forming process for the forming of micro scale cavities is designed and analyzed. The electric device panel may have thousands of cavities in periodic arrays. In this case the analysis of forming considering all the cavities is impossible due to the computational costs. Therefore, analyses are carried out for various numbers of cavity arrays. Based on the analysis results, the optimum analysis conditions are found that guarantee the analysis results and computational efficiency. Then the cavity shape is designed in viewpoint of formability. The formability of the designed cavity is predicted in terms of filling ration and damage value. The optimum pitch distance and draft angle are decided considering the Cockcroft-Latham damage value and under-fill defects.