Abstract
Residual stresses are developed during injection molding process and these cause a warpage and invoke a birefringence in a molded article. The levels of residual stresses are dependent of molding conditions, such as melt temperature, mold temperature, cooling condition, and packing condition. Among the residual stress measurement methods, the photoelasticity method is simple and convenience to measure compared with other methods. However this method can be utilized only for a transparent product. Birefringence and residual stress have been observed in injection molded polycarbonate (PC), polystyrene (PS), and polymethylmethacrylate (PMMA) specimens according to injection molding conditions. Computer simulation has been performed and compared with experimental observation of birefringence. PS specimen showed the highest birefringence whereas PMMA showed the lowest birefringence among them. Locations close to the gate showed higher residual stress than locations far from the gate. Long cooling time, high injection temperature, and long packing time reduced residual stress.
| Original language | English |
|---|---|
| Pages (from-to) | 175-180 |
| Number of pages | 6 |
| Journal | Polymer (Korea) |
| Volume | 40 |
| Issue number | 2 |
| DOIs | |
| State | Published - Mar 2016 |
Keywords
- Birefringence
- Injection molding
- Molding condition
- Residual stress
- Transparent material