TY - GEN
T1 - Analysis of the laser transmission rate of silicon (Si) applied to flip-chip bonding
AU - Song, Chun Sam
AU - Kim, Jong Hyeong
AU - Kim, Joo Han
AU - Kim, Joon Hyun
AU - Kim, Joo Hyun
PY - 2010
Y1 - 2010
N2 - The present study explored a flip-chip packaging method where transmission bonding is performed using the laser beam transmission rate of Si, the main material of flip chips. Here, the transmission of Si by a laser beam using laser wavelength in the IR domain (1,064 nm) was demonstrated through experiments. Further experiments were then conducted where the results were applied to actual flip chip bonding. The mechanical properties of the flip-chip solder joints were analyzed through experiments, and the degree of thermal effect was analyzed through simulation. The results showed that, in flip chip bonding, laser transmission bonding was advantageous in mechanical, thermal, and temporal terms relative to conventional bonding (thermo-compression).
AB - The present study explored a flip-chip packaging method where transmission bonding is performed using the laser beam transmission rate of Si, the main material of flip chips. Here, the transmission of Si by a laser beam using laser wavelength in the IR domain (1,064 nm) was demonstrated through experiments. Further experiments were then conducted where the results were applied to actual flip chip bonding. The mechanical properties of the flip-chip solder joints were analyzed through experiments, and the degree of thermal effect was analyzed through simulation. The results showed that, in flip chip bonding, laser transmission bonding was advantageous in mechanical, thermal, and temporal terms relative to conventional bonding (thermo-compression).
UR - https://www.scopus.com/pages/publications/77955216810
U2 - 10.1109/ECTC.2010.5490660
DO - 10.1109/ECTC.2010.5490660
M3 - Conference contribution
AN - SCOPUS:77955216810
SN - 9781424464104
T3 - Proceedings - Electronic Components and Technology Conference
SP - 2042
EP - 2047
BT - 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010
T2 - 60th Electronic Components and Technology Conference, ECTC 2010
Y2 - 1 June 2010 through 4 June 2010
ER -