Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement

Young Su Ji; Sung Jae Chung; Myoung Ryul Ok; Kyung Tae Hong; Jin Yoo Suh; Jai Won Byeon; Jin Kook Yoon; Kyung Hwan Lee; Kyung Sub Lee

doi:10.1016/j.msea.2006.02.372

Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement

Young Su Ji, Sung Jae Chung, Myoung Ryul Ok, Kyung Tae Hong, Jin Yoo Suh, Jai Won Byeon, Jin Kook Yoon, Kyung Hwan Lee, Kyung Sub Lee

Dept. of Mechanical Convergence Engineering

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

Abstract

The crystallization behavior of Cu₄₃Zr₄₃Al₇Ag₇ (numbers indicate at.%) bulk metallic glass was investigated using the isothermal electrical resistivity measurements at 450 °C in the supercooled liquid region. The crystallization process is a single step phase transformation. To analyze the electrical resistivity reduction, microstructure evolutions were analyzed using differential scanning calorimetry, X-ray diffraction, transmission electron microscopy and small-angle X-ray scattering. The Avrami parameter of the electrical resistivity reduction step was 1.73, indicating that the crystallization process is a diffusion-controlled growth of intermetallic compounds with decreasing nucleation rate.

Original language	English
Pages (from-to)	521-525
Number of pages	5
Journal	Materials Science and Engineering: A
Volume	448-451
DOIs	https://doi.org/10.1016/j.msea.2006.02.372
State	Published - 25 Mar 2007

Keywords

Annealing
Crystallization
Electrical resistivity
Metallic glass

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10.1016/j.msea.2006.02.372

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title = "Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement",

abstract = "The crystallization behavior of Cu43Zr43Al7Ag7 (numbers indicate at.%) bulk metallic glass was investigated using the isothermal electrical resistivity measurements at 450 °C in the supercooled liquid region. The crystallization process is a single step phase transformation. To analyze the electrical resistivity reduction, microstructure evolutions were analyzed using differential scanning calorimetry, X-ray diffraction, transmission electron microscopy and small-angle X-ray scattering. The Avrami parameter of the electrical resistivity reduction step was 1.73, indicating that the crystallization process is a diffusion-controlled growth of intermetallic compounds with decreasing nucleation rate.",

keywords = "Annealing, Crystallization, Electrical resistivity, Metallic glass",

author = "Ji, {Young Su} and Chung, {Sung Jae} and Ok, {Myoung Ryul} and Hong, {Kyung Tae} and Suh, {Jin Yoo} and Byeon, {Jai Won} and Yoon, {Jin Kook} and Lee, {Kyung Hwan} and Lee, {Kyung Sub}",

year = "2007",

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doi = "10.1016/j.msea.2006.02.372",

language = "English",

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journal = "Materials Science and Engineering: A",

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T1 - Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement

AU - Ji, Young Su

AU - Chung, Sung Jae

AU - Ok, Myoung Ryul

AU - Hong, Kyung Tae

AU - Suh, Jin Yoo

AU - Byeon, Jai Won

AU - Yoon, Jin Kook

AU - Lee, Kyung Hwan

AU - Lee, Kyung Sub

PY - 2007/3/25

Y1 - 2007/3/25

N2 - The crystallization behavior of Cu43Zr43Al7Ag7 (numbers indicate at.%) bulk metallic glass was investigated using the isothermal electrical resistivity measurements at 450 °C in the supercooled liquid region. The crystallization process is a single step phase transformation. To analyze the electrical resistivity reduction, microstructure evolutions were analyzed using differential scanning calorimetry, X-ray diffraction, transmission electron microscopy and small-angle X-ray scattering. The Avrami parameter of the electrical resistivity reduction step was 1.73, indicating that the crystallization process is a diffusion-controlled growth of intermetallic compounds with decreasing nucleation rate.

AB - The crystallization behavior of Cu43Zr43Al7Ag7 (numbers indicate at.%) bulk metallic glass was investigated using the isothermal electrical resistivity measurements at 450 °C in the supercooled liquid region. The crystallization process is a single step phase transformation. To analyze the electrical resistivity reduction, microstructure evolutions were analyzed using differential scanning calorimetry, X-ray diffraction, transmission electron microscopy and small-angle X-ray scattering. The Avrami parameter of the electrical resistivity reduction step was 1.73, indicating that the crystallization process is a diffusion-controlled growth of intermetallic compounds with decreasing nucleation rate.

KW - Annealing

KW - Crystallization

KW - Electrical resistivity

KW - Metallic glass

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U2 - 10.1016/j.msea.2006.02.372

DO - 10.1016/j.msea.2006.02.372

M3 - Article

AN - SCOPUS:33847185846

SN - 0921-5093

VL - 448-451

SP - 521

EP - 525

JO - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

ER -

Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement

Abstract

Keywords

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