Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement

Young Su Ji; Sung Jae Chung; Myoung Ryul Ok; Kyung Tae Hong; Jin Yoo Suh; Jai Won Byeon; Jin Kook Yoon; Kyung Hwan Lee; Kyung Sub Lee

doi:10.1016/j.msea.2006.02.372

Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement

Young Su Ji
, Sung Jae Chung
, Myoung Ryul Ok
, Kyung Tae Hong
, Jin Yoo Suh
, Jai Won Byeon
, Jin Kook Yoon
, Kyung Hwan Lee
, Kyung Sub Lee

Dept. of Mechanical Convergence Engineering

Research output: Contribution to journal › Article › peer-review

16 Scopus citations

Abstract

The crystallization behavior of Cu₄₃Zr₄₃Al₇Ag₇ (numbers indicate at.%) bulk metallic glass was investigated using the isothermal electrical resistivity measurements at 450 °C in the supercooled liquid region. The crystallization process is a single step phase transformation. To analyze the electrical resistivity reduction, microstructure evolutions were analyzed using differential scanning calorimetry, X-ray diffraction, transmission electron microscopy and small-angle X-ray scattering. The Avrami parameter of the electrical resistivity reduction step was 1.73, indicating that the crystallization process is a diffusion-controlled growth of intermetallic compounds with decreasing nucleation rate.

Original language	English
Pages (from-to)	521-525
Number of pages	5
Journal	Materials Science and Engineering: A
Volume	448-451
DOIs	https://doi.org/10.1016/j.msea.2006.02.372
State	Published - 25 Mar 2007

Keywords

Annealing
Crystallization
Electrical resistivity
Metallic glass

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10.1016/j.msea.2006.02.372

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@article{09e55b7934524824b9d1e00f29e42193,

title = "Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement",

abstract = "The crystallization behavior of Cu43Zr43Al7Ag7 (numbers indicate at.\%) bulk metallic glass was investigated using the isothermal electrical resistivity measurements at 450 °C in the supercooled liquid region. The crystallization process is a single step phase transformation. To analyze the electrical resistivity reduction, microstructure evolutions were analyzed using differential scanning calorimetry, X-ray diffraction, transmission electron microscopy and small-angle X-ray scattering. The Avrami parameter of the electrical resistivity reduction step was 1.73, indicating that the crystallization process is a diffusion-controlled growth of intermetallic compounds with decreasing nucleation rate.",

keywords = "Annealing, Crystallization, Electrical resistivity, Metallic glass",

author = "Ji, \{Young Su\} and Chung, \{Sung Jae\} and Ok, \{Myoung Ryul\} and Hong, \{Kyung Tae\} and Suh, \{Jin Yoo\} and Byeon, \{Jai Won\} and Yoon, \{Jin Kook\} and Lee, \{Kyung Hwan\} and Lee, \{Kyung Sub\}",

year = "2007",

month = mar,

day = "25",

doi = "10.1016/j.msea.2006.02.372",

language = "English",

volume = "448-451",

pages = "521--525",

journal = "Materials Science and Engineering: A",

issn = "0921-5093",

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TY - JOUR

T1 - Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement

AU - Ji, Young Su

AU - Chung, Sung Jae

AU - Ok, Myoung Ryul

AU - Hong, Kyung Tae

AU - Suh, Jin Yoo

AU - Byeon, Jai Won

AU - Yoon, Jin Kook

AU - Lee, Kyung Hwan

AU - Lee, Kyung Sub

PY - 2007/3/25

Y1 - 2007/3/25

N2 - The crystallization behavior of Cu43Zr43Al7Ag7 (numbers indicate at.%) bulk metallic glass was investigated using the isothermal electrical resistivity measurements at 450 °C in the supercooled liquid region. The crystallization process is a single step phase transformation. To analyze the electrical resistivity reduction, microstructure evolutions were analyzed using differential scanning calorimetry, X-ray diffraction, transmission electron microscopy and small-angle X-ray scattering. The Avrami parameter of the electrical resistivity reduction step was 1.73, indicating that the crystallization process is a diffusion-controlled growth of intermetallic compounds with decreasing nucleation rate.

AB - The crystallization behavior of Cu43Zr43Al7Ag7 (numbers indicate at.%) bulk metallic glass was investigated using the isothermal electrical resistivity measurements at 450 °C in the supercooled liquid region. The crystallization process is a single step phase transformation. To analyze the electrical resistivity reduction, microstructure evolutions were analyzed using differential scanning calorimetry, X-ray diffraction, transmission electron microscopy and small-angle X-ray scattering. The Avrami parameter of the electrical resistivity reduction step was 1.73, indicating that the crystallization process is a diffusion-controlled growth of intermetallic compounds with decreasing nucleation rate.

KW - Annealing

KW - Crystallization

KW - Electrical resistivity

KW - Metallic glass

UR - https://www.scopus.com/pages/publications/33847185846

U2 - 10.1016/j.msea.2006.02.372

DO - 10.1016/j.msea.2006.02.372

M3 - Article

AN - SCOPUS:33847185846

SN - 0921-5093

VL - 448-451

SP - 521

EP - 525

JO - Materials Science and Engineering: A

JF - Materials Science and Engineering: A

ER -

Analysis on the phase transition behavior of Cu base bulk metallic glass by electrical resistivity measurement

Abstract

Keywords

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