Analyzing design change impacts in modular products with analytic network process

Hakyeon Lee; Hyeonju Seol; Nakhwan Sung; Yoo Suk Hong; Yongtae Park

doi:10.1115/DETC2007-35880

Analyzing design change impacts in modular products with analytic network process

Hakyeon Lee, Hyeonju Seol, Nakhwan Sung, Yoo Suk Hong, Yongtae Park

Dept. of Industrial Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

Since parts and systems are closely linked to each other in complex engineering products, a change in a single part or system causes changes in other parts or system, which in turn propagates further. This study aims to propose a novel approach to analysis of design change impacts in modular products with consideration of change propagation. The proposed approach measures the relative change impact (RCI) of each part or module on the whole product using analytic network process (ANP). A case study on the automobile system is presented to illustrate the proposed approach. The practical use of RCI is also discussed.

Original language	English
Title of host publication	2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007
Pages	363-371
Number of pages	9
DOIs	https://doi.org/10.1115/DETC2007-35880
State	Published - 2008
Event	19th Int. Conf. Design Theory and Methodology and 1st Int. Conf. Micro and Nano Systems, presented at - 2007 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2007 - Las Vegas, NV, United States Duration: 4 Sep 2007 → 7 Sep 2007

Publication series

Name	2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007
Volume	3 PART A

Conference

Conference	19th Int. Conf. Design Theory and Methodology and 1st Int. Conf. Micro and Nano Systems, presented at - 2007 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2007
Country/Territory	United States
City	Las Vegas, NV
Period	4/09/07 → 7/09/07

Access to Document

10.1115/DETC2007-35880

Cite this

Lee, H., Seol, H., Sung, N., Hong, Y. S., & Park, Y. (2008). Analyzing design change impacts in modular products with analytic network process. In 2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007 (pp. 363-371). (2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007; Vol. 3 PART A). https://doi.org/10.1115/DETC2007-35880

Lee, Hakyeon ; Seol, Hyeonju ; Sung, Nakhwan et al. / Analyzing design change impacts in modular products with analytic network process. 2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007. 2008. pp. 363-371 (2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007).

@inproceedings{8c4f9b2fff344cd59f6e670fa214ee49,

title = "Analyzing design change impacts in modular products with analytic network process",

abstract = "Since parts and systems are closely linked to each other in complex engineering products, a change in a single part or system causes changes in other parts or system, which in turn propagates further. This study aims to propose a novel approach to analysis of design change impacts in modular products with consideration of change propagation. The proposed approach measures the relative change impact (RCI) of each part or module on the whole product using analytic network process (ANP). A case study on the automobile system is presented to illustrate the proposed approach. The practical use of RCI is also discussed.",

author = "Hakyeon Lee and Hyeonju Seol and Nakhwan Sung and Hong, \{Yoo Suk\} and Yongtae Park",

year = "2008",

doi = "10.1115/DETC2007-35880",

language = "English",

isbn = "0791848027",

series = "2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007",

pages = "363--371",

booktitle = "2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007",

note = "19th Int. Conf. Design Theory and Methodology and 1st Int. Conf. Micro and Nano Systems, presented at - 2007 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2007 ; Conference date: 04-09-2007 Through 07-09-2007",

}

Lee, H, Seol, H, Sung, N, Hong, YS & Park, Y 2008, Analyzing design change impacts in modular products with analytic network process. in 2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007. 2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007, vol. 3 PART A, pp. 363-371, 19th Int. Conf. Design Theory and Methodology and 1st Int. Conf. Micro and Nano Systems, presented at - 2007 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2007, Las Vegas, NV, United States, 4/09/07. https://doi.org/10.1115/DETC2007-35880

Analyzing design change impacts in modular products with analytic network process. / Lee, Hakyeon; Seol, Hyeonju; Sung, Nakhwan et al.
2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007. 2008. p. 363-371 (2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007; Vol. 3 PART A).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Analyzing design change impacts in modular products with analytic network process

AU - Lee, Hakyeon

AU - Seol, Hyeonju

AU - Sung, Nakhwan

AU - Hong, Yoo Suk

AU - Park, Yongtae

PY - 2008

Y1 - 2008

N2 - Since parts and systems are closely linked to each other in complex engineering products, a change in a single part or system causes changes in other parts or system, which in turn propagates further. This study aims to propose a novel approach to analysis of design change impacts in modular products with consideration of change propagation. The proposed approach measures the relative change impact (RCI) of each part or module on the whole product using analytic network process (ANP). A case study on the automobile system is presented to illustrate the proposed approach. The practical use of RCI is also discussed.

AB - Since parts and systems are closely linked to each other in complex engineering products, a change in a single part or system causes changes in other parts or system, which in turn propagates further. This study aims to propose a novel approach to analysis of design change impacts in modular products with consideration of change propagation. The proposed approach measures the relative change impact (RCI) of each part or module on the whole product using analytic network process (ANP). A case study on the automobile system is presented to illustrate the proposed approach. The practical use of RCI is also discussed.

UR - http://www.scopus.com/inward/record.url?scp=44849089603&partnerID=8YFLogxK

U2 - 10.1115/DETC2007-35880

DO - 10.1115/DETC2007-35880

M3 - Conference contribution

AN - SCOPUS:44849089603

SN - 0791848027

SN - 9780791848029

SN - 0791848043

SN - 9780791848043

T3 - 2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007

SP - 363

EP - 371

BT - 2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007

T2 - 19th Int. Conf. Design Theory and Methodology and 1st Int. Conf. Micro and Nano Systems, presented at - 2007 ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2007

Y2 - 4 September 2007 through 7 September 2007

ER -

Lee H, Seol H, Sung N, Hong YS, Park Y. Analyzing design change impacts in modular products with analytic network process. In 2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007. 2008. p. 363-371. (2007 Proceedings of the ASME International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, DETC2007). doi: 10.1115/DETC2007-35880

Analyzing design change impacts in modular products with analytic network process

Abstract

Publication series

Conference

Access to Document

Other files and links

Fingerprint

Cite this