Application of core technologies for smart manufacturing: A case study of cost benefit analysis based on modeling and simulation for sustainability

Chanmo Jun, Ju Yeon Lee, Bo Hyun Kim, Sang Do Noh

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

1 Scopus citations

Abstract

Recently, corporations around the world have been making numerous efforts to innovate manufacturing due to intensified competition. These innovations in manufacturing can be characterized as 'smart' manufacturing technology, and include Cyber Physical System(CPS), Internet of Things(IoT), big data, and cloud computing as applications of diverse information technologies. This study introduces research that has focused on Material Flow Cost Accounting(MFCA) in consideration of sustainability, targeting vehicle recycling factories, using an Modeling and Simulation(M&S) technique, which is one of the core elements of actualizing CPS among the core technologies in smart factory manufacturing. Specifically, this study describes the process from entering necessary data for a simulation to model creation to MFCA analysis, and verifies the applicability of the system using test examples.

Original languageEnglish
Title of host publication2017 Winter Simulation Conference, WSC 2017
EditorsVictor Chan
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages4454-4455
Number of pages2
ISBN (Electronic)9781538634288
DOIs
StatePublished - 28 Jun 2017
Event2017 Winter Simulation Conference, WSC 2017 - Las Vegas, United States
Duration: 3 Dec 20176 Dec 2017

Publication series

NameProceedings - Winter Simulation Conference
ISSN (Print)0891-7736

Conference

Conference2017 Winter Simulation Conference, WSC 2017
Country/TerritoryUnited States
CityLas Vegas
Period3/12/176/12/17

Fingerprint

Dive into the research topics of 'Application of core technologies for smart manufacturing: A case study of cost benefit analysis based on modeling and simulation for sustainability'. Together they form a unique fingerprint.

Cite this