Ar/N2 2단계 플라즈마 처리에 따른 저온 Cu-Cu 직접 접합부의 정량적 계면접착에너지 평가 및 분석

Translated title of the contribution: Effects of Ar/N2 Two-step Plasma Treatment on the Quantitative Interfacial Adhesion Energy of Low-Temperature Cu-Cu Bonding Interface

Sarah Eunkyung Kim

Research output: Contribution to journal › Article › peer-review

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