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Bi가 첨가된 Sn-2.5Ag-0.8Cu-0.05Ni-1Bi 및 Sn-0.75Cu-0.065Ni-1.5Bi 솔더 합금의 응고 거동 및 기계적 특성과 형성 접합부의 미세구조

Translated title of the contribution: Solidification Behavior and Mechanical Properties of Sn-2.5Ag-0.8Cu-0.05Ni-1Bi and Sn-0.75Cu-0.065Ni-1.5Bi Solder Alloys, and Microstructures in Joints Formed Using Them
  • Hye Min Lee
  • , Jung Tak Moon
  • , Young Woo Lee
  • , Hui Joong Kim
  • , Seul Gi Lee
  • , Joug Hyun Lee
  • Seoul National University of Science and Technology (SNUST)
  • MK Electron Co., Ltd.

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

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