Abstract
Interfacial reaction characteristics of a Bi-10Cu-20Sb-0.3Ni Pb-free alloy on Cu pad was investigated by reflow soldering at 430oC. The thickness of interfacial reaction layers with respect to the soldering time was also measured.
After the reflow soldering, it was observed that a (Cu,Ni)2Sb, a Cu4Sb intermetallic layer, and a haze layer, which is consisted of Bi and Cu4Sb phases, were successively formed at the Bi-10Cu-20Sb-0.3Ni/Cu interface. The total thickness of the reaction layers was found to be linearly increased with increasing of the reflow soldering time up to 120 s. As the added Ni element did not participate in the formation of the thickest Cu4Sb interfacial layer, suppression of the interfacial growth was not observed.
After the reflow soldering, it was observed that a (Cu,Ni)2Sb, a Cu4Sb intermetallic layer, and a haze layer, which is consisted of Bi and Cu4Sb phases, were successively formed at the Bi-10Cu-20Sb-0.3Ni/Cu interface. The total thickness of the reaction layers was found to be linearly increased with increasing of the reflow soldering time up to 120 s. As the added Ni element did not participate in the formation of the thickest Cu4Sb interfacial layer, suppression of the interfacial growth was not observed.
| Translated title of the contribution | Interfacial Reaction Characteristics of a Bi-20Sb-10Cu-0.3Ni Pb-free Solder Alloy on Cu Pad |
|---|---|
| Original language | Korean |
| Pages (from-to) | 1-7 |
| Number of pages | 7 |
| Journal | 마이크로전자 및 패키징학회지 |
| Volume | 17 |
| Issue number | 1 |
| State | Published - Mar 2010 |